Solder Paste

To meet the unique soldering requirements of various applications, QLG offers a custom solder powder service, achieved by doping the solder powder with controlled amounts of additional metals such as silver, bismuth, and other elements. This customization service allows manufacturers to tailor solder performance to specific needs, thereby improving properties such as melting point, strength, and thermal conductivity. The solder powder particle size typically ranges from 20 µm to 75 µm, providing the necessary flexibility for fine-pitch stencil printing, high-density interconnects, and general-purpose surface mount technology (SMT) applications. This particle size range ensures that solder paste can effectively fill the increasingly compact and complex spaces in modern electronic components.

Solder paste itself consists of two main components: flux and solder powder. The flux cleans the soldering surface and promotes solder flow, while the solder powder provides the materials needed to form solder joints. The quality and formulation of these two components are crucial for obtaining reliable solder joints that meet industry standards. As an option, pastes can be either packed in syringe or 1kg packing. depending on alloy composition and flux formulation. For optimal preservation, the paste should be stored at 0–10℃, though certain specially formulated pastes may be stored at room temperature without affecting performance.

To ensure safe transport and product integrity, QLG employs a robust double-layer packaging structure for all its solder paste products. The inner layer is a bubble wrap box, providing cushioning protection against physical damage; the outer layer is a reinforced cardboard box, ensuring the solder paste remains safe and undamaged during transport. Each box holds 10 kg of solder paste, facilitating inventory management and meeting production needs for manufacturers. Furthermore, QLG offers OEM packaging services, allowing customers to customize packaging according to their specific brand or logistics requirements.

QLG is committed to quality and has obtained numerous important certifications, including ISO 9001, ISO 14001, ISO 45001, and IATF 16949. These certifications demonstrate the company's commitment to high standards in quality management, environmental responsibility, occupational health and safety, and automotive industry requirements. Therefore, QLG's solder paste offers superior reliability, consistent performance, and excellent solder joint integrity, which is crucial for meeting today's fast-paced and challenging manufacturing environments. By focusing on innovation and quality, QLG has become a trusted partner for companies seeking high-performance solder to meet the evolving needs of the electronics industry.