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High-Quality Solder Paste from China | Trusted Suppliers & Factory for Electronic and Industrial Soldering

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QLG, a leading supplier and factory in China, offers an extensive selection of high-quality solder pastes, ideal for both electronic and industrial soldering applications. Our products are available in various lead-free alloys that comply with European RoHS and REACH directives, ensuring safety and environmental responsibility.

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This solder paste, available in a gray color, has a specific gravity ranging from 7.2 to 8.5, depending on the alloy composition and flux formulation. Each product is conveniently packed in a 500g sealed bottle to maintain freshness and quality.

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Our solder paste options include various compositions such as Sn99.3Cu0.7, Sn99Ag0.3Cu0.7, Sn96.5Ag3Cu0.5, Sn62Pb36Ag2, Sn42Bi58, Sn64.7B35Ag0.3, Sn64Bi35Ag1.0, Sn63Pb37, Sn55Pb45, Sn62.8Pb36.8Ag0.4, Sn63Pb36.8Ag0.2, and Sn5Ag2.5Pb92.5, catering to diverse needs and preferences of our clients.

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    Product Overview

    Custom Solder Powder Service
    To meet the unique soldering requirements of various applications, QLG offers a custom solder powder service, achieved by doping the solder powder with controlled amounts of additional metals such as silver, bismuth, and other elements. This customization service allows manufacturers to tailor solder performance to specific needs, thereby improving properties such as melting point, strength, and thermal conductivity. The solder powder particle size typically ranges from 20 µm to 75 µm, providing the necessary flexibility for fine-pitch stencil printing, high-density interconnects, and general-purpose surface mount technology (SMT) applications. This particle size range ensures that solder paste can effectively fill the increasingly compact and complex spaces in modern electronic components.
    Composition & Storage
    Solder paste itself consists of two main components: flux and solder powder. The flux cleans the soldering surface and promotes solder flow, while the solder powder provides the materials needed to form solder joints. The quality and formulation of these two components are crucial for obtaining reliable solder joints that meet industry standards. As an option, pastes can be either packed in syringe or 1kg packing, depending on alloy composition and flux formulation. For optimal preservation, the paste should be stored at 0–10℃, though certain specially formulated pastes may be stored at room temperature without affecting performance.
    Packaging & Logistics
    To ensure safe transport and product integrity, QLG employs a robust double-layer packaging structure for all its solder paste products. The inner layer is a bubble wrap box, providing cushioning protection against physical damage; the outer layer is a reinforced cardboard box, ensuring the solder paste remains safe and undamaged during transport. Each box holds 10 kg of solder paste, facilitating inventory management and meeting production needs for manufacturers. Furthermore, QLG offers OEM packaging services, allowing customers to customize packaging according to their specific brand or logistics requirements.
    Quality Certifications
    QLG is committed to quality and has obtained numerous important certifications, including ISO 9001, ISO 14001, ISO 45001, and IATF 16949. These certifications demonstrate the company's commitment to high standards in quality management, environmental responsibility, occupational health and safety, and automotive industry requirements. Therefore, QLG's solder paste offers superior reliability, consistent performance, and excellent solder joint integrity, which is crucial for meeting today's fast-paced and challenging manufacturing environments. By focusing on innovation and quality, QLG has become a trusted partner for companies seeking high-performance solder to meet the evolving needs of the electronics industry.

    Product Specification

    Alloy Solid ℃ Liquid ℃
    Sn99.3Cu0.7 227 Eutectic
    Sn99Ag0.3Cu0.7 217 227
    Sn96.5Ag3Cu0.5 217 220
    Sn62Pb36Ag2 183 190
    Sn42Bi58 139 Eutectic
    Sn64.7B35Ag0.3 172
    Sn64Bi35Ag1.0 172
    Sn63Pb37 183 Eutectic
    Sn55Pb45 183 190
    Sn62.8Pb36.8Ag0.4 183
    Sn63Pb36.8Ag0.2 183
    Sn5Ag2.5Pb92.5 287 295

    Detail Pictures

    Frequently Asked Questions

    What customization services does QLG offer for solder powder?
    QLG offers custom solder powder services by doping the powder with controlled amounts of additional metals such as silver, bismuth, and other elements. This allows manufacturers to tailor the melting point, strength, and thermal conductivity of the solder to meet specific application requirements.
    What is the typical particle size range for QLG solder powder?
    The particle size typically ranges from 20 µm to 75 µm. This range provides the necessary flexibility for fine-pitch stencil printing, high-density interconnects, and general-purpose SMT applications.
    How should QLG solder paste be stored?
    For optimal preservation and performance, QLG solder paste should be stored at a temperature of 0–10℃. However, certain specially formulated pastes can be stored at room temperature without affecting their performance.
    What packaging options does QLG provide?
    QLG offers standard packaging in syringes or 1kg packings. For shipping, we use a double-layer packaging structure (bubble wrap box inner and reinforced cardboard box outer) containing 10 kg of paste. Custom OEM packaging is also available.
    What quality certifications does QLG hold?
    QLG is certified under ISO 9001 (Quality Management), ISO 14001 (Environmental Responsibility), ISO 45001 (Occupational Health & Safety), and IATF 16949 (Automotive Industry Standards), ensuring high reliability and consistent performance.